Changes to Step #15
Edit by David Hodson —
Edit approved by David Hodson
- Before
- After
- Unchanged
Step Lines
[* black] More chips on the underside of the logic board: | |
[* red] Qualcomm PM8018 RF power management IC | |
[* yellow] Hynix H2JTDG2MBR 128 Gb (16 GB) NAND Flash | |
[* orange] Apple 338S1131 | |
- | [* green] Apple 338S1117 audio |
+ | [* green] Apple 338S1117 audio codec |
[* blue] STMicroelectronics L3G4200D (AGD5/2235/G8SBI ) low-power three-axis gyroscope—same one as seen in the iPhone 4S, iPad 2, and other leading smart phones. | |
[* violet] Murata 339S0171 Wi-Fi Module |