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Changes to Step #15

Edit by David Hodson

Edit approved by David Hodson

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[* black] More chips on the underside of the logic board:
[* red] Qualcomm PM8018 RF power management IC
[* yellow] Hynix H2JTDG2MBR 128 Gb (16 GB) NAND Flash
[* orange] Apple 338S1131
- [* green] Apple 338S1117 audio CODEC
+ [* green] Apple 338S1117 audio codec
[* blue] STMicroelectronics L3G4200D (AGD5/2235/G8SBI ) low-power three-axis gyroscope—same one as seen in the iPhone 4S, iPad 2, and other leading smart phones.
[* violet] Murata 339S0171 Wi-Fi Module