Changes to Step #2
Edit by Spencer Day —
Edit approved by Spencer Day
- Before
- After
- Unchanged
Step Lines
| [* black] Repeat the previous step to clean and remove all the old liquid metal and its residue from the APU. | |
| [* icon_caution] Don't let any of the liquid metal drip onto the board. | |
| - | [* icon_note] DURING ***DISASSEMBLY*** GOOD POINT TO REPLACE THERMAL PADS ON THE BOTTOM OF THE BOARD/BOTTOM SHIELD PLATE |
| + | [* black] During ''disassembly'' this is a good point to replace any thermal pads on the ''bottom'' of the main board. The pads may be stuck to the bottom shield plate or the main board. |
| + | [* icon_note] It's important that the replacement pads are the same thickness as the originals, otherwise the foam around the APU may not seal properly. |