Changes to Step #2
Edit by Spencer Day —
Edit approved by Spencer Day
- Before
- After
- Unchanged
Step Lines
| + | [* icon_note] Don't remove the foam padding around the APU. |
|---|---|
| [* black] Repeat the previous step to clean and remove all the old liquid metal and its residue from the APU. | |
| [* icon_caution] Don't let any of the liquid metal drip onto the board. | |
| [* black] This is a good point to replace any thermal pads on the ''bottom'' of the main board, if necessary. The pads may be stuck to the both bottom shield plate and the main board. | |
| [* icon_caution] Make sure your replacement pads are the ''same thickness as the originals'', or the foam around the APU may not seal properly. |