Changes to Step #2
Edit by Carsten Frauenheim —
Edit approved by Carsten Frauenheim
- Before
- After
- Unchanged
Step Lines
+ | [title] Remove the old liquid metal from the APU |
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[* icon_note] Don't remove the foam barrier that surrounds the APU. | |
- | [* black] |
- | [* icon_caution] Don't let any of the liquid metal drip onto the board. |
- | [* black] This is a good point to replace any thermal pads on the ''bottom'' of the main board, if necessary. The pads |
- | [* icon_caution] Make sure your replacement pads are the |
+ | [* black] Just as you did for the heatsink, clean and remove all of the old liquid metal and its residue from the APU. |
+ | [* icon_caution] Don't let any of the liquid metal drip onto the board. Liquid metal is conductive and could cause a short. The foam barrier keeps the liquid metal from leaking out. |
+ | [* black] This is a good point to replace any thermal pads on the ''bottom'' of the main board, if necessary. The pads might be stuck to both the bottom shield plate and the main board. |
+ | [* icon_caution] Make sure your replacement pads are ***the same thickness*** as the originals, or the foam around the APU may not seal properly. |