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Changes to Step #2

Edit by Carsten Frauenheim

Edit approved by Carsten Frauenheim

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After
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+[title] Remove the old liquid metal from the APU
[* icon_note] Don't remove the foam barrier that surrounds the APU.
-[* black] Repeat the previous step to clean and remove all the old liquid metal and its residue from the APU.
- [* icon_caution] Don't let any of the liquid metal drip onto the board.
-[* black] This is a good point to replace any thermal pads on the ''bottom'' of the main board, if necessary. The pads may be stuck to both the bottom shield plate and the main board.
- [* icon_caution] Make sure your replacement pads are the ''same thickness as the originals'', or the foam around the APU may not seal properly.
+[* black] Just as you did for the heatsink, clean and remove all of the old liquid metal and its residue from the APU.
+ [* icon_caution] Don't let any of the liquid metal drip onto the board. Liquid metal is conductive and could cause a short. The foam barrier keeps the liquid metal from leaking out.
+[* black] This is a good point to replace any thermal pads on the ''bottom'' of the main board, if necessary. The pads might be stuck to both the bottom shield plate and the main board.
+ [* icon_caution] Make sure your replacement pads are ***the same thickness*** as the originals, or the foam around the APU may not seal properly.