Changes to Step #11
Edit by Miroslav Djuric —
- Before
- After
- Unchanged
Step Lines
[* red] Was ist das? It's actually an Nvidia Tegra processor, buried beneath an Intel package seen on the surface. | |
[* orange] Samsung's moviNAND chip supplies the 8GB of storage space for the Kin. | |
- | [* black] The moviNAND |
- | [* yellow] |
+ | [* black] The moviNAND package can transfer data at speeds up to 52 Mb/s. |
+ | [* yellow] The Qualcomm QSC6085 package delivers up to 1.8 Mbps reverse and 3.8 Mbps forward speed on CDMA-2000 networks. |