Changes to Step #12
Edit by Andrew Bookholt —
- Before
- After
- Unchanged
Step Lines
| [* black] Verizon's on top. | |
| [* black] Although it's the same form factor, this is definitely not the same board. Conspicuously absent is the SIM slot. That's freed up a lot of space for something. | |
| [* black] We'll get the EMI shields off soon enough... | |
| - | [* black] Apple used custom molded rubber bumpers between the chips and the EMI shields. |
| + | [* black] Apple used custom molded rubber bumpers between the chips and the EMI shields presumably to quell any interference between analog and digital circuitry. |