Changes to Step #14
Edit by Andrew Bookholt —
- Before
- After
- Unchanged
Step Lines
| [* black] The back side of the Verizon logic board (on top) contains: | |
| [* red] Qualcomm MDM6600 | |
| [* orange] Toshiba TH58NVG7D2FLA89 16 GB NAND Flash | |
| [* yellow] Toshiba Y890A111222KA | |
| - | [* green] RS KMOD16104 |
| + | [* green] RS KMOD16104 - The logo on this package appears to be that of [link|http://www.elnec.com/support/ic-logos/manufacturer-description/?manuf=Murata+Manufacturing|Murata's]. We suspect that this contains the Broadcom BCM4329 that [link|http://www.eetimes.com/electronics-news/4212938/Teardown-Inside-the-Verizon-iPhone?pageNumber=1|UBM TechInsights] claims to provide Wi-Fi/Bluetooth capability. |
| + | [* icon_note] Adding credibility to this statement is the fact that we found this chip last June in the [guide|3130|GSM iPhone|stepid=15356] and that Murata and Broadcom have had [link|http://www.broadcom.com/press/release.php?id=782505|RF partnerships] in the past. |