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Demontage van de Fairphone 3

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Translating step 9

Step 9
Fairphone 3 Teardown: step 0, image 1 of 3 Fairphone 3 Teardown: step 0, image 2 of 3 Fairphone 3 Teardown: step 0, image 3 of 3

  • Removing the motherboard, we discover a bunch of spring contacts, which connect to the fingerprint sensor, the volume and power buttons, and a few antennas.

  • Pulling off the shields reveals:

  • Qualcomm Snapdragon 632 SoC

  • Samsung KMRH60014A-B614 eMMC with 64 GB

  • Qorvo QM57508 RF front-end module

  • Qualcomm WTR3925 RF transceiver

  • Qualcomm WCN3680B WiFi module

Bij het verwijderen van het moederbord ontdekken we een hoop veercontactjes, die linken naar de vingerafdrukscanner, de volume en aan/uit knoppen, en enkele antennes.

Als we de elektromagnetische afscherming lostrekken, zien we deze componenten:

Qualcomm Snapdragon 632 SoC

Samsung KMRH60014A-B614 LPDDR3 met 64 GB

Qorvo QM57508 RF front-end module

Qualcomm WTR3925 RF transceiver

Qualcomm WCN3680B WiFi module

[* black] Removing the motherboard, we discover a bunch of spring contacts, which connect to the fingerprint sensor, the volume and power buttons, and a few antennas.
[* black] Pulling off the shields reveals:
[* red] [https://www.qualcomm.com/products/snapdragon-632-mobile-platform|Qualcomm Snapdragon 632 SoC|new_window=true]
- [* orange] [https://www.samsung.com/semiconductor/mcp/KMRH60014A-B614/|Samsung KMRH60014A-B614|new_window=true] LPDDR3 with 64 GB
+ [* orange] Samsung KMRH60014A-B614 eMMC with 64 GB
[* yellow] Qorvo QM57508 RF front-end module
[* green] Qualcomm WTR3925 RF transceiver
[* light_blue] Qualcomm WCN3680B WiFi module

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