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Desmontaje del Fairphone 3

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Translating step 10

Step 10
Fairphone 3 Teardown: step 0, image 1 of 2 Fairphone 3 Teardown: step 0, image 2 of 2

  • On the front of the motherboard we find:

  • Qorvo QM56022 RF Flex

  • Qualcomm PMI632 power management IC

  • Qualcomm PM8953 power management IC

  • Qualcomm WCD9326 audio codec

  • Awinic AW88980 audio amplifier

  • NXP Semiconductor Q31A1 (likely NFC controller)

En la parte frontal de la placa madre encontramos:

Qorvo QM56022 RF Flex

CI de administración de potencia Qualcomm PMI632

CI de administración de potencia PM8953

Códec de audio Qualcomm WCD9326

Amplificador de audio Awinic AW88980

NXP Q31A1

[* black] On the front of the motherboard we find:
[* red] Qorvo QM56022 RF Flex
[* orange] Qualcomm PMI632 power management IC
- [* yellow] PM8953 power management IC
+ [* yellow] Qualcomm PM8953 power management IC
[* green] Qualcomm WCD9326 audio codec
[* light_blue] Awinic [http://www.awinic.com/uploads/files/documents/433f722d95be7656900bb128d830ff05.pdf|AW88980|new_window=true] audio amplifier
- [* blue] NXP Q31A1
+ [* blue] NXP Semiconductor Q31A1 (likely NFC controller)

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