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Microsoft Surface Duo Teardown

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Translating step 8

Step 8
Microsoft Surface Duo Teardown: step 0, image 1 of 2 Microsoft Surface Duo Teardown: step 0, image 2 of 2

  • And now for the main event, chips! A lot of this is last year's silicon, but that doesn't mean it's not worth stopping to catalog:

  • Qualcomm Snapdragon 855, layered under 6 GB of SK hynix DRAM

  • 128 GB Toshiba UFS 3.0 storage

  • Qorvo 78052 RF Fusion MHB front-end module

  • Microsoft X904163 display driver

  • Qualcomm SDR8150 LTE Transceiver

  • Qualcomm WCD9340 audio codec

  • Qualcomm PM8150 power management ICs

Und nun zum Hauptevent, den Chips! Vieles davon ist Silizium von letztem Jahr, aber das heißt nicht, dass es nicht wert wäre, es aufzuzählen:

Qualcomm Snapdragon 855, unter einer 6 GB SK hynix DRAM

128 GB Toshiba UFS 3.0 Speicher

Qorvo 78052 RF Fusion MHB Frontend-Modul

Microsoft X904163 Display-Treiber

Qualcomm SDR8150 LTE Transceiver

Qualcomm WCD9340 Audio Codec

Qualcomm PM8150 IC für die Leistungssteurung

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