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Desmontaje de Microsoft Surface Duo

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Translating step 8

Step 8
Microsoft Surface Duo Teardown: step 0, image 1 of 2 Microsoft Surface Duo Teardown: step 0, image 2 of 2

  • And now for the main event, chips! A lot of this is last year's silicon, but that doesn't mean it's not worth stopping to catalog:

  • Qualcomm Snapdragon 855, layered under 6 GB of SK hynix DRAM

  • 128 GB Toshiba UFS 3.0 storage

  • Qorvo 78052 RF Fusion MHB front-end module

  • Microsoft X904163 display driver

  • Qualcomm SDR8150 LTE Transceiver

  • Qualcomm WCD9340 audio codec

  • Qualcomm PM8150 power management ICs

Y ahora para el evento principal, ¡chips! Mucho de esto es el silicio del año pasado, pero eso no significa que no valga la pena detenerse a catalogar:

Qualcomm Snapdragon 855, en capas bajo 6 GB de SK hynix DRAM

128 GB de almacenamiento Toshiba UFS 3.0

MHB módulo frontal Qorvo 78052 RF Fusion

Controlador de pantalla Microsoft X904163

Transceptor LTE SDR8150 de Qualcomm

Códec de audio WCD9340 de Qualcomm

CI de gestión de energía de Qualcomm PM8150

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