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Demontage van de Microsoft Surface Duo

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Translating step 8

Step 8
Microsoft Surface Duo Teardown: step 0, image 1 of 2 Microsoft Surface Duo Teardown: step 0, image 2 of 2

  • And now for the main event, chips! A lot of this is last year's silicon, but that doesn't mean it's not worth stopping to catalog:

  • Qualcomm Snapdragon 855, layered under 6 GB of SK hynix DRAM

  • 128 GB Toshiba UFS 3.0 storage

  • Qorvo 78052 RF Fusion MHB front-end module

  • Microsoft X904163 display driver

  • Qualcomm SDR8150 LTE Transceiver

  • Qualcomm WCD9340 audio codec

  • Qualcomm PM8150 power management ICs

En dan nu het main event, de chips! Veel van het silicoon dat we hierbinnen vinden is van vorig jaar, maar dat weerhoudt ons niet van het in kaart brengen ervan:

Qualcomm Snapdragon 855, onder een 6 GB SK hynix DRAM

128 GB Toshiba UFS 3.0 opslag

Qorvo 78052 RF Fusion MHB front-endmodule

Microsoft X904163 schermdriver

Qualcomm SDR8150 LTE transceiver

Qualcomm WCD9340 audio codec

Qualcomm PM8150 power management IC's

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