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微软 Surface Duo 拆解

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Translating step 8

Step 8
Microsoft Surface Duo Teardown: step 0, image 1 of 2 Microsoft Surface Duo Teardown: step 0, image 2 of 2

  • And now for the main event, chips! A lot of this is last year's silicon, but that doesn't mean it's not worth stopping to catalog:

  • Qualcomm Snapdragon 855, layered under 6 GB of SK hynix DRAM

  • 128 GB Toshiba UFS 3.0 storage

  • Qorvo 78052 RF Fusion MHB front-end module

  • Microsoft X904163 display driver

  • Qualcomm SDR8150 LTE Transceiver

  • Qualcomm WCD9340 audio codec

  • Qualcomm PM8150 power management ICs

现在是主要事件，芯片！其中很多是去年的芯片，但这并不意味着不值得停产：

高通Snapdragon 855，分层安装在6 GB的SK hynix DRAM之下

128 GB东芝UFS 3.0存储

Qorvo 78052 RF Fusion MHB前端模块

Microsoft X904163显示驱动程序

高通SDR8150 LTE收发器

高通WCD9340音频编解码器

高通PM8150电源管理IC

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