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iPhone 5S Teardown by X-ray

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Translating step 5

Step 5
iPhone 5S Teardown by X-ray: step 0, image 1 of 2 iPhone 5S Teardown by X-ray: step 0, image 2 of 2

  • A quick analysis of the BGA voiding in the Apple 338S120L shows voids as large as 35%. That does not mean this is a problem, but certainly something a quality manager would need to check and validate. Besides, none of the other surface mount components in the iPhone 5S have this level of voiding.

  • The BGA inspector allows us to visualize the void in a 3D representation of x-y and density as the height of the volume.

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