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iPhone 5S Teardown by X-ray

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Translating step 4

Step 4
iPhone 5S Teardown by X-ray: step 0, image 1 of 1

  • We know voids in ball grid arrays (BGA) can be problematic to the reliability of any electronic product. In our x-ray inspection of the iPhone 5S, we noticed that the Apple 338S120L chipset had a large number of voids. So the natural next step was to use the BGA inspector included in the TruView 200 to measure the voids.

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