I work in the IT Hardware industry, building, updating, testing, and sometimes physically fixing components for servers, storage arrays, and networking equipment.
My first try with this resulted in a half-melted / deformed bud, but it still works fine. Attempt #2 (on the other bud, 2 months later) I used a thermal imager to be certain I was bringing the temperature up steadily. Around 160-180F the adhesive was soft enough to pull apart, without deforming the plastic at all.
Pretty fine margins getting the heat right. I melted my casing slightly and am now trying to re-shape it back to normal. A note about the cure time on the glue would be a good addition to this. I used the e6000 i had lying around but it looks like this doesn't cure as quickly as the e8000. Thanks for the guide!