Introduction
This is a prerequisite-only guide! This guide is part of another procedure and isn't meant to be used alone.
What you need
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Heat an iOpener and apply it to the back cover's right edge for two minutes.
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Apply a suction cup to the back of the phone, as close to the middle of the right edge as possible.
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Pull up on the suction cup with a strong, steady force to create a gap between the back cover and the frame.
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Insert an opening pick into the gap.
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Slide the pick along the right edge to slice the adhesive.
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Leave the pick in the bottom right edge to prevent the adhesive from resealing.
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Apply a heated iOpener to the back cover's bottom edge for two minutes.
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Rotate the pick around the bottom right corner to slice the adhesive.
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Insert an opening pick between the right edge of the camera bezel and the motherboard cover.
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Slide the pick back and forth along the edge to slice the adhesive.
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Lift the camera bezel from the phone and remove it.
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This is a good point to test your phone's functionality before sealing it up. Use this guide to run a hardware test. Be sure to power your phone back down completely before you continue working.
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If you are replacing the fingerprint sensor or screen assembly, use this guide to calibrate the fingerprint sensor.
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Follow this guide to replace the back cover and camera bezel adhesive.
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Insert the pointed end of a spudger underneath the tape that connects the wireless charging coil to the speaker on the bottom left of the phone.
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Slowly lift the spudger up until the tape detaches from the speaker.
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Insert a spudger underneath the tape that connects the wireless charging coil to the daughterboard cover on the bottom right of the phone.
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Slowly lift the spudger up until the tape detaches.
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Slowly pull the motherboard cover up and away from the phone and remove it.
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To reassemble your device, follow these instructions in reverse order.
To reassemble your device, follow these instructions in reverse order.
