Skip to main content
Help

iBook G4 14" 933 MHz-1.33 GHz Heat Sink Replacement

Editing Step 4 —

Notice: You are editing a prerequisite guide. Any changes you make will affect all 2 guides that include this step.

Step Type:

Drag to rearrange

It may be necessary to soften the thermal paste between the logic board and heat sink. You can soften the thermal compound using a hairdryer. Move the hairdryer back and forth over the ribbed metal section of the heat sink for one minute. At this point, the heat sink should come free easily.

Use a spudger to pry the heat sink up on the left side, near the hard drive.

Your contributions are licensed under the open source Creative Commons license.