The board is interesting in that it is has a single layer of conductive traces connecting all the components. Contrast this to modern circuit boards, which can sometimes have eight [!] PCB layers.

The larger components on the board include:

RF modulator

Buzzer

ICs provided by Texas Instruments. These 16 pin DIPs are quite the departure from TI's OMAP 3630 found in the Droid 2. The logo is still just as cool, though.