You're going to heat the solder pad and the component lead very hot for 2 to 3 seconds. The pad and lead should readily melt the solder wire.

Press the tip against the circuit board's solder pad and the component lead for about 1 second to heat them both. Angle the tip so it has maximum contact with the pad and lead.

If you're using a narrow soldering tip or working with a large solder pad, you may not be able to transfer enough heat to the area. You can try increasing the temperature by 50°C or switch to a larger tip for more effective heat transfer.

If you heat the circuit board continuously for more than 10 seconds, the excessive heat may damage the solder pad or component. Additionally, it could start loosening adjacent components.

Feed the solder wire into the heated area until there's a concave pool of solder surrounding the lead.

This should happen within a few seconds. If the solder doesn't adhere to the pad, apply flux to the pad or increase the temperature.

Don't feed the solder directly onto the tip as it won't flow properly into the pad and lead causing a weak connection.

Remove the solder wire, then remove the soldering iron from the solder pad.